About Us
Doctech is a pioneering company specializing in surface metal treatment technologies, chemical additives, and advanced materials for semiconductor packaging. We are committed to developing cutting-edge solutions that address the dynamic needs of the 3D IC packaging and electronics industries.
Position: Internship: Semiconductor Electroplating / Packaging Solutions
Key Responsibilities:
Lead the research and development of electroplating solutions for surface metal treatments, focusing on advanced additive formulations.
Conduct in-depth material characterization and performance analysis of electroplated metals and coatings.
Collaborate with the R&D team to innovate and optimize formulations to enhance metal deposition quality, conductivity, and stability.
Design and execute experiments to test electrochemical properties and develop novel methodologies for improved metal adhesion and corrosion resistance.
Provide technical guidance and support for scale-up processes from laboratory to production.
Qualifications:
Bachelor degree or undergraduate in Chemistry, Electrical, Material Science Engineering, or a related field
Proven experience in electrochemistry, particularly in the development of electroplating solutions.
Expertise in materials analysis techniques and other related testing methodologies will be a PLUS.
Strong laboratory skills, with experience in metal deposition and surface treatment technologies.
Ability to thrive in a collaborative, fast-paced environment while managing multiple research projects.