Doctech HK Limited

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HS-T11M Series Cu Plating Solution

The Cu HS-T11M series was initially designed for high-throughput applications, including copper micro-pillars, interconnects, and TSV or related copper deposition in the PCB industry. The Cu HS-T11M series utilizes a two-component additive, ensuring excellent stability in acidic copper environments. In the photovoltaic industry, using copper plating as a new metalization solution to replace silver paste can save more than 60% of production costs. The Cu HS-T11M series of copper plating solutions provided by Doctech enables stable deposition at high current densities. Cu HS-T11M has successfully passed the on-machine testing conducted by photovoltaic companies. The product can be formulated, packaged, and quality-controlled according to the specific requirements of the industry, providing a comprehensive solution for high-quality customers.

Advantages

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· Capable of thick plating and suitable for Cu post/Cu bump forming

· Ability to plate at high current densities

· Ability to plate with insoluble anode

· Excellent throwing power

· Less material stress in copper film

· Completely analyzable additive package by CVS measurement

CF-T11M Series Cu Plating Solution

PET copper foil plays a crucial role as the electrode in new energy lithium-ion batteries, contributing significantly to enhancing the stability of the battery structure. It mitigates the expansion and contraction caused by the battery's charge and discharge, thereby extending the battery's lifespan. Additionally, PET copper foil holds significance in thermal management within the battery, aiding in the conduction and dispersion of the heat generated by the battery, maintaining an optimal operating temperature. Compared to traditional copper foils, PET polymer film can enhance the safety and stability of the battery.

Our CF-T11M electroplated copper series achieves a low internal stress effect similar to that of PET polymer film under low-speed electroplating. This reduction minimizes material delamination between interfaces and simultaneously produces a smooth, bright copper-plated surface at the corresponding current density. Furthermore, in the realm of material applications for high-frequency copper foils, a copper layer containing twin crystals is expected to enhance efficiency.