We have developed a series of copper electroplating solutions to meet the high standards of emerging electronic packaging material requirements, including high thermal stability, superior mechanical performance, and chemical resistance. Our flagship products are hybrid nanotwin / nanograin copper electroplating solution and nanograin copper electroplating
solution. They stand out for their exceptional quality and are well-suited for future high-end semiconductor components, with the flexibility to be customized. With independently
developed advanced technologies, we continuously improve our products and processes, aiming to be a leading service-oriented provider of chemical technologies.